Driven On-Chip Integration for High Density and Low Cost” was published by researchers at University of Southern California.

Over the past decade, colloidal quantum dots (QDs) have emerged as promising materials for next-generation displays due to ...

A new battery technology has been developed that delivers significantly higher energy storage—enough to alleviate EV range ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Ceramic resonators offer an attractive alternative to quartz crystals for stabilizing oscillation frequencies in many ...

Abstract: A novel physics-based methodology of electromigration (EM) assessment, previously validated on dedicated test grids [1], [2], has been employed for analyzing EM reliability of a VDD net in ...

So, you want to know about metallization in semiconductor chips? It’s basically how we create the tiny metal pathways that ...

To enhance analogue and mixed-signal verification, Toshiba has adopted Siemens’ Solido Simulation Suite and Solido Design ...

With the rapid rise of emerging technologies such as AI, high-performance computing (HPC) and 5G, demand for improved chip ...

MIT researchers have developed a new fabrication method that could enable the production of more energy efficient electronics by stacking multiple functional components on top of one existing circuit.

Abstract: Very-large-scale integration (VLSI) technology scaling has resulted in a substantial rise in power density within a chip. This leads to thermal nonuniformity across integrated circuits (ICs) ...