Abstract: As the market increases for Artificial Intelligence and High-Performance Computing applications, the geometry of 3-Dimensional Integrated Circuit packages becomes more complicated; therefore ...
Abstract: The major function of underfill is to reduce stress from coefficient of thermal expansion (CTE) mismatch and protect bump. For three-dimensional integrated circuit (3DIC) demand, large TSI ...
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Full vinyl wrapped tumbler tutorial
Have you been intimidated by the thoughts of fully wrapping a tumbler with a single sheet of vinyl? Well, fear no more! In ...
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