New research reveals why even state-of-the-art large language models stumble on seemingly easy tasks—and what it takes to fix ...

Abstract: This paper presents a novel voltage-ramping (V-ramp) wafer-level electromigration (EM) testing method aimed at reducing testing time. The EM behavior of copper (Cu) metal lines with both ...

Abstract: The gradual tool wear is unavoidable in the machining process, it directly influences the surface integrity and dimensional tolerances of the components. The tool condition monitoring (TCM) ...