A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
Annular dark field scanning electron microscopy images of a bilayer interface after heat pulses at 500° (left), 600° (middle) and 700° (right). Dashed colored lines mark the positions of the interface ...
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