Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has sh ...
29% of thermal engineers are having to compromise the accuracy of their simulations due to hardware limitations, according to The State of Thermal, a survey of over 170 thermal engineers conducted by ...
Vishay Intertechnology, Inc. introduced a new version of its free ThermaSim online thermal simulation tool for power MOSFETs, microBUCK® power ICs, and DrMOS products: ThermaSim 3.0. For precise ...
Fabric might be the last thing on your mind when firefighters rescue someone from a burning building, but without fire-resistant clothing, such rescues might not happen at all. The turnout gear that ...
The electronics industry exists in a continuous state of evolution. The world’s biggest companies are either launching new products, or refining and improving existing ones. In keeping with consumer ...
It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback