Semiconductor Engineering

Automate Memory Test Through A Shared Bus Interface

The use of memory-heavy IP in SoCs for automotive, artificial intelligence (AI), and processor applications is steadily increasing. However, these memory-heavy IP often have only a single access point ...
Semiconductor Engineering

Module Testing Adds New Challenges

System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...
Linux Journal

Using the Kernel Security Module Interface

At the 2001 Linux Kernel Summit, NSA developers presented their work on Security-Enhanced Linux (SELinux) and emphasized the need for enhanced security support in the main Linux kernel. In the ensuing ...
EDN

Using the MSSP Module to Interface SPI Serial EEPROMs with PIC18 Devices

This application note explains the use of MSSP module to interface SPI™ serial EEPROMs with PIC18 devices. This document include the firmware description, initialization, write enable, read status ...
PV Tech

Record 83% module test failure in Kiwa PVEL’s 2025 Module Reliability Scorecard

“Four years ago, that was at 50% and it’s steadily increased since,” said Tristan Erion-Lorico. Image: Kiwa PVEL. A total of 83% of module manufacturers have had at least one test failure in the Kiwa ...